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Surface Mount PLCCA Specifications

Low Profile Surface Mount Plastic Leaded Chip Carrier Sockets Specifications

plcc-76.jpg (214608 octets)
bulletAccepts JEDEC PLCC's - MO-047AA-AH and MO-052 AE.
bulletVisual aids for registration.
bulletLow profile for high density PC board stacking.
bulletStandoffs provide clearance for heat dissipation and cleaning.
bulletAvailable in all popular sizes, with tube, or tape and reel packaging.
bulletPolarization pins available for all sizes.

 

 

SUBJECT: PLCCA/SMT xxPIN PART NO:AT-PLCCA-SMT-XX-1(S)
  1. Scope:
  2. This PLCC (plastic leaded chip carrier) sockets are designed to carry JEDEC Type A chips on 1.27 mm (0.050in.) centerlines. It is available in surface-mount configurations of :

    20 pin positions.

    28 pin positions.

    32 pin positions.

    44 pin positions.

    52 pin positions.

    68 pin positions.

    84 pin positions.

    The socket’s low-profile design minimizes overall height. And high temperature plastic suitable for all SMT soldering processes.

  3. Applicable Specifications:
  4. The following documents form a part of this specification to the extent specified herein. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence.

    MIL-STD-202F Test methods for electronic and electrical component parts.

    MIL-STD-1344A Test methods for electronic connector.

    UL 94 Flammability standard.

    MIL-T-10727 Tin plating standard.

    FED-QQ-N-290 Nickel plating standard..

    FED-QQ-B-750 Phosphor bronze standard.

  5. Requirements:

3-1 Design and construction: Product shall be of the design, construction and physical dimensions specified in the applicable product drawing.

3-2 Materials:

3-2.1 Housing: Polyphenylene sulfide UL-94V-0. Color: BROWN.

3-2.2 Contact: Phosphor bronze.

3-3 Finishes: Selected Tin 150m "(3.75m m) minimum on solder tail area, and selective Nickel 50m "(1.27m m) minimum overall.

3-4 Ratings:

3-4.1 Voltage rating: 120V AC.

3-4.2 Current rating: 1A max.

3-4.3 Operating Temperature: -55 C to +105 C

3-5 Product Dimension: Ref. Customer drawing.

4.Quality Assurance Provisions

4-1 Test specimens shall be inspected to assure compliance to the requirements of this specification.

4-2 No sample shall be reused unless otherwise specified.

5.Packaging:

Parts shall be packaged tubes or tape&reel.

6.Supplementary Information:

The recommended PCB layout as shown on customer drawing are not to be used for the acceptance nor rejection of the part herein.

7.Test Requirements And Procedures Summary:

Para.

Test Items

Requirements

Procedures

Mechanical Requirements

7-1

Contact Retention Force 0.3 Kg MIN. (per pin) Apply axial push force at the speed rate of 25mm/minute.

MIL-STD-1344A,method 2007.1

Result: Contact Resistance

unit: Kg

MAX. MIN. AVE.
0.9 0.6 0.8

7-2

Solderability Solderable area shall have a solder coverage of 95 % minimum. After 5-10 sec flux deep. Subject connector lead to solder both (63% Sn / 37% Pb) at 230 5 C for 50.5 seconds

MIL-STD-202F, method 208E

Result: Over 95% coverage on solder tail.

7-3

Resistance to Soldering Heat No evidence of defects on surface. to solder at 260 5 C for 50.5 seconds, no evidence of distortion of plastic or metal components or any other damage when examined under 3X magnification.

MIL-STD-202F, method 210A

Result: No damage.

7-4

Insertion Force Used gauge of MAX.: 6.0 KG MAX.

Used gauge of MIN.: 1.5 KG MAX.

Subject mated applicable gauge (MAX. and MIN.) Operation speed shall be 25~100 mm/minute.

MIL-STD-1344A,method 2013.1

Result: MAX. MIN. AVE.

unit: Kg I. MAX. GAUGE 4.2 3.5 3.8

II. MIN. GAUGE 1.3 1.2 1.3

 

7-5

Withdrawal Force Used gauge of MAX.: 3.5 KG MIN.

Used gauge of MIN.: 0.8 KG MIN.

Subject mated applicable gauge (MAX. and MIN.) Operation speed shall be 25~100 mm/minute.

MIL-STD-1344A,method 2013.1

Result: MAX. MIN. AVE.

unit: Kg I. MAX. GAUGE 3.7 3.6 3.6

II. MIN. GAUGE 1.9 1.0 1.1

7-6

Durability Used gauge of MAX.: 10 times

or

Used gauge of MIN.: 20 times

Contact Resistance less than twice of initial.

No physical damage.

Subject mated applicable gauge (MAX. or MIN.) Operation speed shall be 25~100 mm/minute.

 

 

MIL-STD-1344A,method 2006

Result: Contact Resistance MAX. MIN. AVE.

unit: milliohms 25.8 16.9 22.8

No physical damage.

7-7

Vibration Contact Resistance less than twice of initial.

No physical damage.

 

 

 

Mated applicable gauge and Subject to the following vibration conditions, for a period of 2 hours in each of 3 mutually perpendicular axes, passing DC 1mA during the test.

Amplitude: 1.5mm P-P.

Frequency: 10-55-10 Hz.

MIL-STD-1344A,method 2005.1 condition I

Result: Contact Resistance MAX. MIN. AVE.

unit: milliohms 28.6 19.9 25.6

No physical damage.

 

Electrical Requirements

7-8

Contact

Resistance

(Low Level)

30 milliohms MAX. Subject mated applicable I.C. and measure by dry circuit, of 100 mA MAX. 20mV .

MIL-STD-1344A-method 3002.1

Result: MAX. MIN. AVE.
unit: milliohms 13.0 6.7 8.7

7-9

Insulation

Resistance

1000 megaohms min. Apply 500 V DC test potential across contacts, and contacts to housing.

MIL-STD-1344A-method 3003.1

Result: Insulation resistance 1000 megaohms min.

7-10

Dielectric

Strength

Connector must withstand test potential of 600 VAC (RMS) for 1 minute. No evidence of flashover or breakdown. Measure by applying test potential between the contacts, and contacts to housing.

MIL STD-1344A-method 3001.1

Result: No evidence of flash-over or breakdown.

 

Environments Requirements

7-11

Salt Spray Contact Resistance less than twice of initial.

30 milliohms MAX.

Subject mated applicable connectors to 5% salt concentration , 35 1 C temperature, 95-98% humidity for 48 hours.

MIL-STD-202F,method 101D condition B

Result: Contact Resistance

unit: milliohms

MAX. MIN. AVE.
24.2 20.5 21.6

7-12

Humidity Contact Resistance less than twice of initial.

30 milliohms MAX.

Dielectric Strength no damage.

Subject mated applicable connectors to 40 2 C temperature, 90-95% humidity for 96 hours. taken within 30 minute after tested.

MIL-STD-1344A,method 1002.2 condition B (Type I)

Result: Contact Resistance

unit: milliohms

MAX. MIN. AVE.
24.1 22.1 24.3
Dielectric Strength (After Test) no damage.